Intel has been showing off its liquid cooling products in Taiwan
Intel expands its liquid cooling tech to support Nvidia's future AI chips Superfluid cooling tackles 1.5kW heat loads for high-performance systems Taiwan partnerships position Intel as cooling leader for next-gen chips It's no secret that Intel, which recently appointed Lip-Bu Tan as its new CEO, is facing difficult times. The iconic chipmaker is reportedly considering spinning off its foundry division into a joint venture with TSMC in a bid to turn things around, but separate from those plans, Intel is also looking to change its fortunes by becoming a major player in cooling next-generation AI hardware. The company's Superfluid cooling solution is reportedly capable of managing heat output up to 1.5kW per chip, a level of performance that could be essential for cooling Nvidia's GB300 superchip and also for upcoming rack servers, like those shown off at GTC 2025. Blowing bubbles At its event, Nvidia unveiled mock-ups of Kyber-based NVL576 racks featuring Rubin Ultra GPUs. According to Nvidia's co-founder, president, and CEO Jensen Huang, these systems could draw as…