MIT researchers fabricated 3D chips with alternating layers of semiconducting material grown directly on top of each other. The method eliminates thick silicon between layers, leading to better and faster computation, for applications like more efficient AI hardware.

The next step (well, the next, next step for some companies) seems pretty clear; it's the complementary field effect transistor (FET). Which potentially cuts the size of logic cells in half. What comes after that? Click through, dear Spectrum reader.

Tech makes millions of connections in a square millimeter of silicon

NEO Semiconductor says 3D X-DRAM is the world's first 3D NAND-like technology for DRAM memory, a solution developed to solve DRAM's capacity bottleneck while replacing the entire...

Intel's Core i9-14900KS is the best that the lineup has to offer, but how does it match up against AMD's Ryzen 9 7950X3D?

Prototype chip gains huge performance boosts from wafer-to-wafer bonding

Semiconductor chips have traditionally been manufactured in two dimensions. But as devices become more powerful and compact, the industry is increasingly turning to 3D chip designs, which...

In a Spring update, AMD has announced six new Zen 2 and Zen 3 chips, in addition to the availability details of the Ryzen 7 5800X3D.

Intel's IEDM 2022 research papers hold promising new tech.

Advances in semiconductors are feeding the AI boom

Semron, a German startup founded by Dresden University alumni, pioneers 3D-scaled AI chips using memcapacitors, promising energy-efficient, cost-effective AI on mobile devices.

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Arm-based Apple Silicon chips have brought significant change in the way Mac users run their software, especially when it comes to gaming. Compatibility with traditional x86 applications...

AMD is rumored to be working on several Ryzen AM4 CPUs which include Zen 3D V-Cache and even more low-end options for gamers.

Lightmatter uses light signals inside a processor's package

3D chip tech, smaller logic cells, backside power, and more

How advanced defect detection is enabling the next wave of chip innovation

Only '90s kids will understand the deep excitement I feel in my bones about this.

UK-based AI computer company Graphcore made a significant boost to its computers' performance without changing much of anything about its specialized AI processor cores. The secret is TSMC's wafer-on-wafer 3D integration technology.

IBM Research partnered with Tokyo Electron to streamline the 3D chip stacking process and alleviate the strain on the chip industry for years to come.