MIT researchers fabricated 3D chips with alternating layers of semiconducting material grown directly on top of each other. The method eliminates thick silicon between layers, leading to better and faster computation, for applications like more efficient AI hardware.

The new Broadcom Tomahawk 5 is a 51.2Tbps switch chip that supports up to 64x 800GbE and new silicon photonics and co-packaged optics options

Tools are coming, but advanced resists and masks need to keep pace.

Startup claims to solve longstanding problems with graphene on chips

In advance of Intel's first event dedicated to their Foundry business, I had the opportunity to sit down one-on-one with CEO Pat Gelsinger and talk about the company's strategic goals.

Although halide perovskite light-emitting devices exhibit exceptional properties, such as high efficiency, high color purity and broad color gamut, their industrial integration generally suffers from the technological complexity of devices' multilayer structure alongside in-operation-induced heating poor stability.

Today, the PyTorch Team has finally announced M1 GPU support, and I was excited to try it. Here is what I found.

From DLRM to LLM, internal workloads win, but how does Google fare in external workloads?

A new material for flexible electronics could enable multilayered, recyclable electronic devices and help limit e-waste. The material was developed at MIT, the University of Utah, and Meta.

Thousands of students from Southeast Asia join Taiwan's semiconductor work-study programs, but many end up in low-paid factory jobs with little room for advancement.

Micron's revolutionary 232-layer 3D NAND is about to change the storage game, and here's what that means for the future of computing -- personal to the cloud.

As anyone who has recently tried out an augmented reality headset knows, the technology is not yet ready to be part of our everyday lives. Researchers have been working to perfect high-performing augmented reality (AR) glasses, but there are a number of challenges. One major problem with conventional AR glasses is that there is a tradeoff in terms of quality and brightness between the external scene you actually…

Investment experts participating in our MoneyShow Top Picks 2022 report offer a look at a diversified range of telecom and networking stocks for those looking to dial up gains in 2022.

Two decades ago, to build a portable music player, you had to clobber together several hundred electronic components. Today, you can accomplish the same with a single chip and a dozen passives. Heck, you might even get Wi-Fi and Bluetooth for free. One of the few discrete components that survive and thrive in this reality is the humble decoupling capacitor. It's not just that the device is hard to manufacture on…

EUV Lithography to keepMoore's alive has been a journey of turning technology possibility into business innovation through partnerships

The same math that describes supernovas makes EUV lithography possible

Spliced binned-Pareto distributions are flexible enough to handle symmetric, asymmetric, and multimodal distributions, offering a more consistent metric.

Planar to FinFET to Nanosheet to Complementary FET to 2D

When you're baking a cake, it's hard to know when the inside is in the state you want it to be. The same is true—with much higher stakes—for microelectronic chips: How can engineers confirm that what's inside has truly met the intent of the designers? How can a semiconductor design company tell wh

Manufacturability reaches sufficient level to compete with flip-chip BGA and 2.5D.