Wafer-Scale Integration

Cerebras' wafer-scale engine (WSE) technology merges multiple dies on a single wafer. It addresses the challenges of memory bandwidth, latency, and scalability, making it suitable for artificial intelligence. This work evaluates the WSE-3 architecture and compares it with leading GPU-based AI accelerators, notably Nvidia's H100 and B200. The work highlights the advantages of WSE-3 in performance per watt and memory…

Using nanotechnology, scientists have created a newly designed neuromorphic electronic device that endows microrobotics with colorful vision. The newly designed artificial vision device could have far-reaching applications for the fields of medicine, artificial intelligence, and microrobotics.

Metal-semiconductor junctions, electrical junctions in which a metal is linked to a semiconducting material, are crucial components for numerous electronic and optoelectronic devices. While they are now widely produced and used worldwide, creating good quality junctions that integrate conventional metals and 2D semiconductors can be difficult.

There are two types of packaging that represent the future of computing, and both will have validity in certain domains: Wafer scale integration and