Thermal Resistance

There might be a weird reason behind your skyrocketing monthly bills.

Cooler bonding, microfluidics, and engineered TIMs help get the heat out.

Intel research and collaborations in thermal technologies help extend Moore's Law and improve sustainability of data centers.

Researchers at the University of Illinois at Urbana-Champaign and the University of California, Berkeley have recently devised an invention that could cool down electronics more efficiently than other alternative solutions.

A good-quality thermal paste can make a difference when it comes to CPU temperatures. These are the best of the bunch.

This superalloy can withstand some enormous pressure.

Adata unveiled the NeonStorm NVMe SSD at Computex with a liquid cooler that needs to be seen to be believed. The water cooling system that dwarfs the...

Materials key to important applications in aerospace and energy generation must be able to withstand extreme conditions such as high temperatures without failing. Now a team of MIT-led engineers reports a simple, inexpensive way to strengthen one of the key materials used today in such applications.

Researchers at ORNL have developed new insulation materials that are more environmentally friendly than polystyrene.

As devices get smaller and more powerful, the risk of them overheating and burning out increases substantially. Despite advancements in cooling solutions, the interface between an electronic chip and its cooling system has remained a barrier for thermal transport due to the materials' intrinsic roughness.

Raijintek Morpheus 8069 VGA leaks out It has been a while since the last time we covered an aftermarket air cooler for graphics cards.  Morpheus 8069 is the upcoming VGA cooler from Raijintek compatible with AMD and NVIDIA GPUs. Multiple product renders have been leaked ahead of official November 1st launch. We also have some […]

Advanced packaging challenges grow as chips and package sizes shrink; different equipment, technologies gain traction.

Igor Wallossek conducted his test using the thermal paste from a brand new Manli RTX 4080 Gallardo. Wallossek used the ASTM D5470-17 standard for conducting thermal conductivity...

Tech makes millions of connections in a square millimeter of silicon

Tokyo Institute of Technology scientists have devised a 3D DRAM stack topped by a processor to provide four times more bandwidth than HBM.

ARPA-E program targets greater than two times improvements in cooling efficiency for future 2 kilowatt processors.

In our latest installment we introduced the merits of our Hybrid Immersion Liquid Cooling Technology. This new approach to cooling essentially enables new scenarios within the data centre all the while significantly reducing power consumption by up to 20% for cooling systems dedicated to servers. Amongst other benefits, it helps for operation in harsh climatic … Understanding OVHcloud's data centres: how Delta T…

Advances in devices, materials, and packaging technologies all contribute to power problems. But do you need to be concerned about each transistor and wire?

Learn all about thermodynamics, the science that explores the relationship between heat and energy in other forms.